JPS6210940Y2 - - Google Patents
Info
- Publication number
- JPS6210940Y2 JPS6210940Y2 JP1982019891U JP1989182U JPS6210940Y2 JP S6210940 Y2 JPS6210940 Y2 JP S6210940Y2 JP 1982019891 U JP1982019891 U JP 1982019891U JP 1989182 U JP1989182 U JP 1989182U JP S6210940 Y2 JPS6210940 Y2 JP S6210940Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- airtight
- crystal element
- base
- wire insertion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989182U JPS58123573U (ja) | 1982-02-17 | 1982-02-17 | 水晶素子用気密端子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989182U JPS58123573U (ja) | 1982-02-17 | 1982-02-17 | 水晶素子用気密端子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58123573U JPS58123573U (ja) | 1983-08-23 |
JPS6210940Y2 true JPS6210940Y2 (en]) | 1987-03-14 |
Family
ID=30032079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989182U Granted JPS58123573U (ja) | 1982-02-17 | 1982-02-17 | 水晶素子用気密端子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58123573U (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56119270U (en]) * | 1980-02-13 | 1981-09-11 |
-
1982
- 1982-02-17 JP JP1989182U patent/JPS58123573U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58123573U (ja) | 1983-08-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0817954A (ja) | 電気部品用パッケージおよびその製造方法 | |
US3524249A (en) | Method of manufacturing a semiconductor container | |
JPS6210940Y2 (en]) | ||
JP2004511087A (ja) | 気密封止した部品組立体パッケージ | |
JPH024513Y2 (en]) | ||
JPS6374312A (ja) | 電子部品の製造方法 | |
JPH024510Y2 (en]) | ||
JPS623898Y2 (en]) | ||
JPS6210942Y2 (en]) | ||
JPS6234455Y2 (en]) | ||
JPS6119555Y2 (en]) | ||
JPH024511Y2 (en]) | ||
JPH043407Y2 (en]) | ||
JPS6240441Y2 (en]) | ||
JPH0357019Y2 (en]) | ||
JPS59143348A (ja) | 電子部品 | |
JPH03262314A (ja) | 弾性表面波装置 | |
JPH0516724Y2 (en]) | ||
JPH0431745Y2 (en]) | ||
JPS6210941Y2 (en]) | ||
JPH0241822Y2 (en]) | ||
JPH0138918Y2 (en]) | ||
KR0145079B1 (ko) | 외부방향으로 아크된 다이 캐비티를 구비한 반도체 디바이스 패케지 및 집적회로 패케지 | |
JPH0224266Y2 (en]) | ||
JPH0331083Y2 (en]) |